1.Open equipment power switch, set temperature parameters on C10 temperature controller,(weld lead solderball,220-240 degree/lead free solderball,245-265 degree

2. Use soldering iron to clean pads of bga and PCB, use solder wick to drag pad.

3. Use the special cleaner or industrial alcohol cleaning flux residues.

4. On pad surfaces of BGA, PCB, coated with a small amount of aid solder paste evenly daub, ensure to binding and help of welding effect.

5. Choose solder ball corresponding with bga chip, when welding machines shows actual temperature and set temperature keep same, put BGA chip that finish reballing on high temperature resistant cloth, then put them on the left heating plate, set corresponding time, then press the start button to heate.

6. Observe whether tin ball trends and pad keep correspond.

7. When keep correspond, then put bga chip on the right cooling plate.

8. After solder ball cooling, if there is burr on the surface of Solder ball, wipe flux paste on solder ball, heating again will be better.

9. Take away bga chip that finish reballing process, and then turn off power.

BGA Preheater BGA Welding Oven Heating Plate

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