Semi Automatic BGA Rework Station Optical Alignment MST-R02

•Power: AC 220V±10％ 50/60 Hz

•Total Power: Max 5300W

•Heater Power: Top heater 1200W Bottom heater 1200W IR heater 2700 W

•Electrical materials：Intelligence Programmable Controller

•Temperature control: K-type thermocouple (Closed Loop),

independence temperature control, accuracy within2~3℃

•Positioning: Laser Positioning and V-groove, PCB support

•PCB size: Max 410×370 mm

•BGA chip: Max 80×80mm Min 1×1 mm

•Dimensions：L640×W630×H900 mm

•Weight：68kg

Semi Automatic BGA Rework Station Optical Alignment MST-R02

For Laptop Computer Playstation Mobile Phone Motherboard Repair

• Repair Component Type:BGA/QFP/QFN/CSP/SOP,etc

• Component size: 1 ~ 80MM

• Temperature Precision: 2~3 ℃

• Machine Movement: Automatically Remove / Mount Component.

• CCD Optical Alignment System Placing Precision: 0.015MM

• Laser Positioning Function for fast positioning component and PCB.

• Highly Sensitive Mounting Pressure Control to protect PCB from damage.

• Repair Success Rate: 99%+