MST-B32 Single Head, Suitable for Laptop LCD Panel Repair
Big Bonding Head 1.2*68mm Optional;
Extra Camera for PCB Bonding Inspection Optional;
220V/110V Optional;
1, Main Features
Applicable for 32 inch LCD COF, TAB Bonding by pulse heating pressing,
2, Specification
Model Number |
MST-B32 |
Bonding Type |
Pulse Heating |
Power Supply |
AC220V, 50Hz |
Power |
1.5KW |
Temperature Range |
RT~350 ℃ |
Temperature accuracy |
±0.5℃ |
Bonding Pressure Range |
5 ~ 20Kgf |
Hot Pres Time |
1 ~ 50s |
Hot Pres Precision: |
Pitch 60um |
Bonding Head Size |
50*1.5mm |
Bonding head adjust method |
Manual |
Heating segments |
4 segments) |
Hot press accuracy |
X:± 0.1 ㎜、Y:± 0.2 ㎜ |
TAB Fixture |
Micrometer 3 axis Adjustment |
Stage Moving Method |
Manual |
Human-machine interface |
7 inch colorful touch screen |
Optical Position |
HD Optical lens (A&F) |
CCD Monitor |
HD CCD & LCD Monitor |
Productivity |
28pcs/h |
Air source supply |
0.5~0.7 Mpa |
Working environment |
10-60 ℃ |
Machine size |
800*850*1520mm |
Machine weight |
150kg |